Contact angle measurement provides an understanding of the material surface analysis and is a useful tool in process control, surface modification process development and quality control.
In semiconductor industry static contact angle measurements are used to qualify the cleanliness of silicon wafers and ciscuit boards during the manufacturing process. Also quality and uniformity of coatings can be detected with contact angle measurements.
A video clip on a contact angle measurement used in verifying if a coating has attached to a wafer can be found at Theta pages.
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