Wafer characterization by contact angle

Contact angle is a sensitive characterization technique, enabling fast and accurate characterization of surface properties. This technique is well suited for studies or quality control of wafers.

By placing a drop of known liquid (typically water) onto a solid, one can measure the contact angle formed and thus study the wetting behavior of the drop of liquid. The wetting is directly correlated to the surface properties and a small change in surface material or cleanliness will lead to a change in contact angle.

An optical tensiometer is the instrument of choice to measure the contact angle between a drop of water and a wafer. Please find additional information on the technique as well as 2 application examples in the pdf file available for download on this page.

Application example 1: checking wafer cleanliness by measuring static contact angle
Application example 2: studying surface coating properties by measuring dynamic contact angle

 

DOWNLOAD HERE THE DOCUMENT "QUICK AND PRECISE WAFER QUALITY CONTROL: THE CONTACT ANGLE TECHNIQUE."

 


 

 

 

 

 

Published on 25 October, 2010
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